CV
Please email me if you need a PDF version of my latest CV.
Education
- Ph.D. in Electrical and Computer Engineering, University of Illinois Urbana-Champaign
- B.Eng. in Electronic and Computer Engineering, Hong Kong University of Science and Technology
Publications
- Mozart: Taming Taxes and Composing Accelerators with Shared-Memory
Vignesh Suresh, Bakshree Mishra, Ying Jing, Zeran Zhu, Naiyin Jin, Charles Block, Paolo Mantovani, Davide Giri, Joseph Zuckerman, Luca P. Carloni, Sarita Adve
The International Conference on Parallel Architectures and Compilation Techniques (PACT), 2024. - A 12nm Linux-SMP-Capable RISC-V SoC with 14 Accelerator Types, Distributed Hardware Power Management and Flexible NoC-Based Data Orchestration
Maico Cassel dos Santos, Tianyu Jia, Joseph Zuckerman, Martin Cochet, Davide Giri, Eric Jens Loscalzo, Karthic Swaminathan, Thierry Tambe, Jeff Jun Zhang, Alper Buyuktosunoglu, Kuan-Lin Chiu, Giuseppe Di Guglielmo, Paolo Mantovani, Luca Piccolboni, Gabriele Tombesi, David Trilla, John-David Wellman, En-Yu Yang, Aporva Amarnath, Ying Jing, Bakshree Mishra, Joshua Park, Vignesh Suresh, Sarita Adve, Pradip Bose, David Brooks, Luca P. Carloni, Kenneth L. Shepard, Gu-Yeon Wei
IEEE International Solid-State Circuits Conference (ISSCC), 2024. - Trireme: Exploration of Hierarchical Multi-level Parallelism for Hardware Acceleration
Georgios Zacharopoulos, Adel Ejjeh, Ying Jing, En-Yu Yang, Tianyu Jia, Iulian Brumar, Jeremy Intan, Muhammad Huzaifa, Sarita Adve, Vikram Adve, Gu-Yeon Wei, David Brooks
ACM Transactions on Embedded Computing Systems (TECS), 2023. - FARSI: An Early-stage Design Space Exploration Framework to Tame the Domain-specific System-on-chip Complexity
Behzad Boroujerdian, Ying Jing, Devashree Tripathy, Amit Kumar, Lavanya Subramanian, Luke Yen, Vincent Lee, Vivek Venkatesan, Amit Jindal, Robert Shearer, Vijay Janapa Reddi
ACM Transactions on Embedded Computing Systems (TECS), 2023. - ILLIXR: Enabling End-to-End Extended Reality Research
Muhammad Huzaifa, Rishi Desai, Samuel Grayson, Xutao Jiang, Ying Jing, Jae Lee, Fang Lu, Yihan Pang, Joseph Ravichandran, Finn Sinclair, Boyuan Tian, Hengzhi Yuan, Jeffrey Zhang, Sarita V. Adve
IEEE International Symposium on Workload Characterization (IISWC), 2021.
Best Paper Award
IEEE MICRO Top Picks 2022 - Human Skin-Inspired Integrated Multidimensional Sensors Based on Highly Anisotropic Structures
Haomin Chen, Ying Jing, Jeng-Hun Lee, Liu Dan, Jungmo Kim, Shusheng Chen, Kan Huang, Xi Shen, Qingbin Zheng, Jinglei Yang, Seokwoo Jeon, Jang-Kyo Kim
Materials Horizons, 2020.
Talks
- Composable Hardware Acceleration for Immersive Computing
- Agile Software-Hardware Co-Design of AI-Centric Heterogeneous SoCs (EPOCHS) tutorial, held in conjunction with the 51st International Symposium on Computer Architecture (ISCA), June 2024.
- Towards Flexible and Low-overhead Memory Hierarchies for Heterogeneous Systems
- 2022 ADA Center Liaison Meeting, August 2022.
- ILLIXR - Tutorial and ADA Opportunities
- 2021 ADA Center Annual Symposium, November 2021.
- ILLIXR: Enabling End-to-End Extended Reality Research
- Main program in 2021 IEEE International Symposium on Workload Characterization (IISWC), November 2021.
- ILLIXR: Illinois Extended Reality Testbed Enabling Augmented and Virtual Reality Architecture and Systems Research
- Tutorial, held in conjunction with the 48th Symposium on Computer Architecture (ISCA), June 2021.
- ILLIXR: Illinois Extended Reality Testbed
- Tutorial, held in conjunction with the 26th International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS), April 2021.
Technical Service
- Session Chair, PACT 2024
- Artifact Evaluation Committee Member, SOSP 2024
- Selection Committee Member, PACT 2024 SRC
Awards
- UIUC Teachers ranked as excellent by their students with outstanding ratings (2024)
- IISWC 2021 Best Paper Award (2021)
- ADA Center 2020 Lynn Conway Research Award (2020)
- HKUST Continuing UG Scholarship (2018, 2017, 2016)
- Hong Kong Government Reaching Out Award (2018)
- HKUST Study Abroad Sponsorship (2018)
Programming Skills
- Python
- C++
- C
- SystemC
- Verilog
- Matlab
- Java
- Chiesel
- JavaScript
- Groovy
- VHDL
Tools
- gem5
- Stratus HLS
- LLVM
- Latex
- Vivado HLS
- Android Studio
Languages
- Mandarin
- English
- Cantonese
- Japanese